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Axiom 8GB DDR4-3200 ECC SODIMM for HP – 141J2AA

$92.50 $184.99 Save 50%

SKU:

JPWY221639923

Category:

Axiom 8GB DDR4-3200 ECC SODIMM for HP – 141J2AA – For Notebook – 8 GB – DDR4-3200/PC4-25600 DDR4 SDRAM – 3200 MHz – ECC – 260-pin – SoDIMM

Manufacturer : Axiom Memory Solutions

Manufacturer Part No : 141J2AA-AX

Features

  • Enables efficient and smooth execution of all your heavy-duty applications with maximum productivity
  • Up to 3200 MHz speed for smooth computer performance
  • 8 GB memory allows you to have more programs open at a time
  • 260-pin-pin DDR4 SDRAM interface multiplexes 2-bit data from memory cell and I/O buses to minimize processor idle time and enhance your computer’s performance
  • 260-pin pins for faster dependable performance and better access to data and information
  • Notebook device support for your ram module for maximum productivity and convenience
  • SoDIMM form factor with 260-pin pins and 8 GB memory size for enhanced performance and speed to allow maximum usability

Product Details

Product TypeRAM ModuleMemory StandardDDR4-3200/PC4-25600Memory TechnologyDDR4 SDRAMMemory Size8 GBBrand NameAxiomForm FactorSoDIMMManufacturerAxiom Memory SolutionsMemory Speed3200 MHzProduct Name8GB DDR4-3200 ECC SODIMM for HP – 141J2AADevice SupportedNotebookError CheckingECCManufacturer Part Number141J2AA-AXManufacturer Website Addresshttp://www.axiommemory.comMarketing Information

Axiom’s DDR4 Modules use the latest evolutionary DRAM design provides improved speed power management and reliability. The release of DDR4 delivers an overall performance improvement of up to 30% for single DIMM configurations. DDR4 performance scales up to 65% faster in 3-DIMM per channel (3DPC) applications over DDR3.

High bandwidth and faster data rates combined with lower voltage demands deliver the most compelling and significant DRAM computing update in the past decade.

DDR4 Features:

  • 100% Increase in speed – Faster Data Rate equates to more responsive application loads on data-intensive programs.
  • 300% increase in component densities – Equals larger modules for next-generation performance demands.
  • 20% decrease in power consumption – Less power consumed means less wasted resources to cool systems and reserves battery program for mobile devices.
  • Provides greater reliability availability and serviceability (RAS) in enterprise applications – Complete integrity and fault tolerance for longer periods without system failure.
  • Improved data signal.
  • Number of Pins260-pin

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